Finding your suitable ic glue remover is not easy. You may need consider between hundred or thousand products from many store. In this article, we make a short list of the best ic glue remover including detail information and customer reviews. Let’s find out which is your favorite one.
Reviews
1. KINWAT 1 Bottle 30ml Chip BGA IC Adhesive Glue Removing Epoxy Remover Cell Phone CPU Chip Cleaner Repair Remove Glue Liquid Tool
Description
1 Bottle 30ml Chip BGA IC Adhesive Glue Removing Epoxy Remover Cell Phone CPU Chip Cleaner Repair Remove Glue Liquid Tool2. OlogyMart Glue Remover Cold Thin Blade Tech Processors Knife for iPhone CPU A7 A10 Mainboard IC Repair Tool
Feature
Japan steel SSZ cryogenic treatment processPackage includeds
1 x Glue Memover Cold Blade 008 Knife
Description
Features :
A special process handle,sandblasting can produce a shine in the alloy surface and fine texture with frosted effect,alloy in point solution after applying a current in the metal surface to form a colored oxide layer.
Edge hand-made by more than 10 years working experience in maintenance technician manually polish all the way, the manual processing technology to improve the smooth sharp edge at the same time, and repeat grinding easier
Japan steel SSZ cryogenic treatment process.
Package includeds :
1 x Glue Memover Cold Blade 008 Knife
3. TOLOVI 1 Bottle BGA IC Adhesive Glue Epoxy Remover 30ml Cell Phone CPU Chip Cleaner for Softening Removing Resinating Glue
Feature
Type:EpoxiesUnit Type:piece
Package Weight:0.11kg (0.24lb.)
Package Size:35cm x 30cm x 10cm (13.78in x 11.81in x 3.94in)
Description
HW0001993
Specification:Brand new
Size: approx. 90*38mm
Capacity: 30ml
Feature:30ml BGA IC glue epoxy remover.
Can help you soften & remove resinating / sealing glue of chip BGA IC of mobile phones easily.
Can quickly soften and loosen solidified resin adhesive such as epoxy, phenolics, acrylate, polyurethane, organosilicon etc.
It won't do harm to your circuit board and components.
Environment friendly and safe. Doesn't contain any Benzene Coderivative substances with cause leukaemia.
Convenient to use.
How to Use:1. Pick an bigger size absorbent cotton than BGA IC with a tweezers and dip into the removing liquid. Then cover it evenly on BGA IC chip which in need of glue removing.
2. Place a plastic bag or film on the top and cover the PCB board.
3. Wait for about 20 minutes.
4. Redo step 1 to step 3.
6. Heat up the chip with a air tool (300 deg.C). The glue in the bottom will get melt and soften by heat.
7. To remove the chip with a tweezers or cutter.
Package included:1 x BGA Glue
1 x User Manual
Item color displayed in photos may be showing slightly different on your computer monitor since monitors are not calibrated same.
EMS, DHL, FEDEX, UPS are available with discount.
goods within
39-60
days, please wait for your package patiently.FEDEX will spend 5-15 workdays for you to get your items, thank you.Your encouragement and support is our continuously forward momentum.
Thank you very much!
Best Wishes!
4. TOLOVI 1 Bottle BGA IC Adhesive Glue Removing Epoxy Remover Cell Phone CPU Chip Cleaner 30ml Repair Remove Liquid Tool
Feature
Type:EpoxiesUnit Type:piece
Package Weight:0.11kg (0.24lb.)
Package Size:35cm x 30cm x 10cm (13.78in x 11.81in x 3.94in)
Description
HW0001993
Specification:Brand new
Size: approx. 90*38mm
Capacity: 30ml
Feature:30ml BGA IC glue epoxy remover.
Can help you soften & remove resinating / sealing glue of chip BGA IC of mobile phones easily.
Can quickly soften and loosen solidified resin adhesive such as epoxy, phenolics, acrylate, polyurethane, organosilicon etc.
It won't do harm to your circuit board and components.
Environment friendly and safe. Doesn't contain any Benzene Coderivative substances with cause leukaemia.
Convenient to use.
How to Use:1. Pick an bigger size absorbent cotton than BGA IC with a tweezers and dip into the removing liquid. Then cover it evenly on BGA IC chip which in need of glue removing.
2. Place a plastic bag or film on the top and cover the PCB board.
3. Wait for about 20 minutes.
4. Redo step 1 to step 3.
6. Heat up the chip with a air tool (300 deg.C). The glue in the bottom will get melt and soften by heat.
7. To remove the chip with a tweezers or cutter.
Package included:1 x BGA Glue
1 x User Manual
Item color displayed in photos may be showing slightly different on your computer monitor since monitors are not calibrated same.
EMS, DHL, FEDEX, UPS are available with discount.
goods within
39-60
days, please wait for your package patiently.FEDEX will spend 5-15 workdays for you to get your items, thank you.Your encouragement and support is our continuously forward momentum.
Thank you very much!
Best Wishes!
5. WillBest 1 Bottle 30ml Chip BGA IC Adhesive Glue Removing Epoxy Remover Cell Phone CPU Chip Cleaner Soften Repair Liquid Tool
Description
1 Bottle 30ml Chip BGA IC Adhesive Glue Removing Epoxy Remover Cell Phone CPU Chip Cleaner Soften Repair Liquid Tool6. NASHINAL Multifuctional Burin CPU Motherboard Thin Blade Glue Remover Knife Mobile Phone Electronic Device IC Chip Repair Tools Burin Set NEW PRODUCT
Description
Repaired Knife CPU Motherboard Burin Remove Phone Processors Knife for iPhone IC Chip Repair Thin Blade Tools SetFeatures:Multi-purpose glue remover with two handles and two blade plates (each blade has 8 blades)
The product has high quality ,fine grinding and polishing, adopting Japanese alloy steel ssz cryogenic treatment, sharper single-sided special-shaped cutting process, high hardness, high rebound, high precision.
Specifications:Blade plate material: Japanese alloy steel ssz
Size: handle length 12.8cm/5.04 in
1. Due to the different monitor and light effect, the actual color of the item might be slightly different from the color showed on the pictures. Thank you!
2 x Handles
2 x Blade Plates
7. TOLOVI 1 Bottle 30ml Chip BGA IC Adhesive Glue Removing Epoxy Remover Cell Phone CPU Chip Cleaner Repair Remove Glue Liquid Tool
Feature
Type:EpoxiesUnit Type:piece
Package Weight:0.11kg (0.24lb.)
Package Size:35cm x 30cm x 10cm (13.78in x 11.81in x 3.94in)
Description
HW0001993
Specification:Brand new
Size: approx. 90*38mm
Capacity: 30ml
Feature:30ml BGA IC glue epoxy remover.
Can help you soften & remove resinating / sealing glue of chip BGA IC of mobile phones easily.
Can quickly soften and loosen solidified resin adhesive such as epoxy, phenolics, acrylate, polyurethane, organosilicon etc.
It won't do harm to your circuit board and components.
Environment friendly and safe. Doesn't contain any Benzene Coderivative substances with cause leukaemia.
Convenient to use.
How to Use:1. Pick an bigger size absorbent cotton than BGA IC with a tweezers and dip into the removing liquid. Then cover it evenly on BGA IC chip which in need of glue removing.
2. Place a plastic bag or film on the top and cover the PCB board.
3. Wait for about 20 minutes.
4. Redo step 1 to step 3.
6. Heat up the chip with a air tool (300 deg.C). The glue in the bottom will get melt and soften by heat.
7. To remove the chip with a tweezers or cutter.
Package included:1 x BGA Glue
1 x User Manual
Item color displayed in photos may be showing slightly different on your computer monitor since monitors are not calibrated same.
EMS, DHL, FEDEX, UPS are available with discount.
goods within
39-60
days, please wait for your package patiently.FEDEX will spend 5-15 workdays for you to get your items, thank you.Your encouragement and support is our continuously forward momentum.
Thank you very much!
Best Wishes!
8. Soldering Tools - BGA IC Adhesive Removing Liquid Glue Epoxy Remover Cell Phone CPU Chip Cleaner
Feature
Package Includes: 1 x Adhesive Removing Liquid | 1 x User Manual | Details pictures:- It can help you soften & remove resinating / sealing glue of chip BGA IC of mobile phones easily.
- It can quickly soften and loosen solidified resin adhesive such as epoxy, phenolics, acrylate, polyurethane, organosilicon etc.And it won't do harm to your circuit board and components.
- This is a environment friendly item and it's very safe. Doesn't contain any Benzene Coderivative substances with cause leukaemia.
How to use:
Description
Features:- It can help you soften & remove resinating / sealing glue of chip BGA IC of mobile phones easily.
- It can quickly soften and loosen solidified resin adhesive such as epoxy, phenolics, acrylate, polyurethane, organosilicon etc.And it won't do harm to your circuit board and components.
- This is a environment friendly item and it's very safe. Doesn't contain any Benzene Coderivative substances with cause leukaemia.
How to use:
1. Pick an bigger size absorbent cotton than BGA IC with a tweezers and dip into the removing liquid. Then cover it evenly on BGA IC chip which in need of glue removing.
2. Place a plastic bag or film on the top and cover the PCB board.
3. Wait approx. 20 minutes
4. Redo step 1 to step 3.
5. To remove the softened sealing glue in the outside of BGA IC chip with a tweezers. Please pay attention to avoid damaging routes surrounding BGA and copper foil circuit around main board when removing the glue.
6. Heat up the chip with a air gun (300 deg.C). The glue in the bottom will get melt and soften by heat;
7. To remove the chip with a tweezers or cutter.
Caution: This glue removing liquid shall not touch skin, eyes. Please close it after using. If touched by accident, Please wash with water immediately.
Specifications:
Usage: Electronic Components
Quantity: 30ml
Size Of Box: 3.8cm x 3.7cm x 8.8cm
(1cm=0.393Inches)
Package includes:
1 x Adhesive Removing Liquid
1 x User Manual
Details pictures:
9. jp2804047_32883209757
Feature
DIY Supplies:ElectricalApplication:Household Tool Set
Type:Knives
Unit Type:piece
Package Weight:0.058kg (0.13lb.)
Description
Repaired Knife CPU Motherboard Burin Remove Phone Processors Knife for iPhone IC Chip Repair Thin Blade Tools SetFeatures:Multi-purpose glue remover with two handles and two blade plates (each blade has 8 blades)
The product has high quality ,fine grinding and polishing, adopting Japanese alloy steel ssz cryogenic treatment, sharper single-sided special-shaped cutting process, high hardness, high rebound, high precision.
Specifications:Blade plate material: Japanese alloy steel ssz
Size: handle length 12.8cm/5.04 in
1. Due to the different monitor and light effect, the actual color of the item might be slightly different from the color showed on the pictures. Thank you!
2 x Handles
2 x Blade Plates
10. VHLL Non-Slip Metal Scalpel Knife Tools Kit Cutter Engraving Craft CPU knives Mobile Phone PCB DIY Repair Thin Blad Hand Tools NEW
Feature
Size:12.8cmApplication:Household Tool Set
Type:Combination
DIY Supplies:Metalworking
Package: other
Description
Repaired Knife CPU Motherboard Burin Remove Phone Processors Knife for iPhone IC Chip Repair Thin Blade Tools SetFeatures:Multi-purpose glue remover with two handles and two blade plates (each blade has 8 blades)
The product has high quality ,fine grinding and polishing, adopting Japanese alloy steel ssz cryogenic treatment, sharper single-sided special-shaped cutting process, high hardness, high rebound, high precision.
Specifications:Blade plate material: Japanese alloy steel ssz
Size: handle length 12.8cm/5.04 in
1. Due to the different monitor and light effect, the actual color of the item might be slightly different from the color showed on the pictures. Thank you!
2 x Blade Plates