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Feature

Type:Epoxies
Unit Type:piece
Package Weight:0.11kg (0.24lb.)
Package Size:35cm x 30cm x 10cm (13.78in x 11.81in x 3.94in)

Description

HW0001993

Specification:

Brand new

Size: approx. 90*38mm

Capacity: 30ml

Feature:

30ml BGA IC glue epoxy remover.

Can help you soften & remove resinating / sealing glue of chip BGA IC of mobile phones easily.

Can quickly soften and loosen solidified resin adhesive such as epoxy, phenolics, acrylate, polyurethane, organosilicon etc.

It won't do harm to your circuit board and components.

Environment friendly and safe. Doesn't contain any Benzene Coderivative substances with cause leukaemia.

Convenient to use.

How to Use:

1. Pick an bigger size absorbent cotton than BGA IC with a tweezers and dip into the removing liquid. Then cover it evenly on BGA IC chip which in need of glue removing.

2. Place a plastic bag or film on the top and cover the PCB board.

3. Wait for about 20 minutes.

4. Redo step 1 to step 3.

6. Heat up the chip with a air tool (300 deg.C). The glue in the bottom will get melt and soften by heat.

7. To remove the chip with a tweezers or cutter.

Package included:

1 x BGA Glue

1 x User Manual

Item color displayed in photos may be showing slightly different on your computer monitor since monitors are not calibrated same.

EMS, DHL, FEDEX, UPS are available with discount.

goods within

39-60

days, please wait for your package patiently.

FEDEX will spend 5-15 workdays for you to get your items, thank you.

Your encouragement and support is our continuously forward momentum.

Thank you very much!

Best Wishes!