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Feature

Ultra-thin desoldering wick
Responds as much as 50% faster than conventional desoldering braids
Lighter mass and pure copper braid construction
Better thermal conductivity, even at low temperatures
Overheating minimized by requiring less heat for shorter time

Description

Chem-Wik®Rosin is an advanced, ultra-thin desoldering wick that responds as much as 50% faster than conventional desoldering braids. Its lighter mass and pure copper braid construction allows for better thermal conductivity, even at low temperatures. Overheating of critical heat-sensitive components and circuits is minimized by requiring less heat for a shorter period of time. It also requires less "contact" pressure delivering greater operator comfort. Effectively removes all solder from through-hole, surface mount and BGA components and pads. Prevents shorts by removing solder bridges, cleans etched script for positive identification and removes unwanted solder from edge connectors, fingers, wrap-pins, lugs and terminals. The braiding pattern is a uniquely designed geometric weave for maximum speed and solder holding capacity. An ultrasonically applied, pure water white rosin flux is laminated onto the entire braid to protect against oxidation and to promote solderability. Conforms to all the qualitive requirements of the following specifications: MIL-F-14256E Type R.; NASA STD-8739.3; ANSI/IPC J STD-004, Type ROLO (USA) Clear Bobbin; Size: 25 FT.; Green (#7); .075" Wide