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Feature

BGA reball stencil template for iPhone 4 4S 5 5C 5S 5SE 6 6P 6S 6SP 7 7P 8 8P X
Plate nand flash + baseband + eeprom
Easy and quickly for reballing the BGA IC
High success rate of planting tin,the solder balls can be formed once after you are proficient.
Promised shipping : shipped within 2 work days and delivered 7-15 work days( we provide the effective tracking number)

Description

VIPFIX 15Pcs BGA Reballing Stencils Set High Precision PCB Motherboard BGA Reballing Stencil Net BGA Soldering Repair Station for iPhone 5 5S 5C 6 6P 6S 6SP 7 7P 8 8P X

Product Introduction:
VIPFIX Multi-Purpose Phone BGA Stencil Template for iPhone all series, for iPhone 4 4S 5 5S 5C 6 6p 6S 6SP 7 7p 8 8p plant tin plate: CPU, font, audio, power IC Plant Tin steel net.
VIPFIX Multi-Purpose BGA Reballing Stencils Template can be heated by the hot air gun, it is easy and quickly for reballing the BGA IC, Large set of common need in BGA working. Package included, 15pcs BGA Reballing Stencil Template for 4s 5 5C 6 6plus 6s plus 7 7plus 8 plus x
Plate nand flash + baseband + eeprom