(5g) Thermal Conductive Heatsink Plaster Viscous Adhesive Compound Glue For PC GPU IC

Feature

Thermal properties, strong adhesion.
Melting capacity: 0 (200degree celsius/ 24Hours)
Evaporation: 0.001% (200 degree celsius/ 24Hours)
Thermal conductivity: > 1.2W/m-K Thermal
Impedance:> 0.06

Description

(5g) Thermal Conductive Heatsink Plaster Viscous Adhesive Compound Glue For PC GPU IC Works perfect to hold heatsink or cooling for laptop desktop north-bridge chips. etc