75g + 10g Thermal Conductive Silicone Plaster Viscous Adhesive Compound Cooling Glue For LED GPU Chipset Heatsink

Related posts

Feature

50ml /PCS , approx. 75g

Description

100% New Heatsink plaster
Application: apply to all heatsinks no fixed clip thermal paste. Idea for MOSFET HeatsinksVGA CARD Northbridge Southbridge Heatsink.
Special properties: High Conductivity; low bleed; stable at high temperatures.
Features: thermal properties, strong adhesion
Thermal Resistance: <0.246 -in /W
Type: silicone fluid.
Physical From: Grease-like
Evaporation: 0.001% (200 / 24Hours)
Thermal conductivity:> 0.671W/m-K
Dielectric Breakdown: >6.0 KV ac
Maximum Use Temperature: -20~250.
Strength of connected buildings: 25Kg
Insulation coefficient> 5.1 * Dissipation coefficient <0.005
50ml /PCS , approx. 75g